Description and Technical Data:
The FAN6050 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
Product Description
The FAN6050 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
Product parameters
- ● 12V single supply
● Dimensions: 59 x 49 mm form factor
What's Inside the Box
| FAN6050 | 1 |
|---|
Product Matrix
| Product Model | USD Price |
|---|---|
| FAN6050 | 15 |
More Details:
Accessories