Description and Technical Data:
The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
Product Description
The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
Product parameters
- ● 12V single supply
● Dimensions: 80 x 60 mm form factor
What's Inside the Box
| FAN8060 | 1 |
|---|
Product Matrix
| Product Model | USD Price |
|---|---|
| FAN8060 | 18 |
More Details:
Accessories