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Trenz Electronics

MPSoC-Modul mit AMD Zynq UltraScale+ ZU3EG-1I, 2 GByte DDR4, 4 x 5 cm, LP (TE0820-05-3BI51QL)


The TE0820-05-3BI81ML is a low-profile, 4 × 5 cm MPSoC module built around the AMD Zynq UltraScale+ ZU3EG-1I.

634.00 € 634.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany

Description and Technical Data:

1) Overview/Key Features

The TE0820-05-3BI81ML is a low-profile, 4 × 5 cm MPSoC module built around the AMD Zynq UltraScale+ ZU3EG-1I. It integrates 2 GByte DDR4 SDRAM, 128 MByte QSPI boot flash, 8 GByte e.MMC storage, on-board power supplies, and high-speed connectors for a broad range of I/O. The module is designed for embedded computing and FPGA/SoC applications; its operating temperature in a particular system depends on the design and cooling solution.

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
SoCAMD Zynq UltraScale+ XCZU3EG-1SFVC784I
Speed grade-1
Temperature gradeIndustrial
PackageSFVC784
DDR4 SDRAM2 GByte
Boot flash128 MByte QSPI, dual-parallel mode
e.MMC storage8 GByte
Additional memoryMAC-address serial EEPROM with EUI-48 node identity
Programmable logic I/O132 HP PL I/Os
Processing-system I/O14 PS MIOs
PS GTR transceivers4
High-speed interfacesPCIe 2.1, SATA 3.1, DisplayPort source, USB 3.0, serial GMII
On-board componentsLattice MachXO2 CPLD, programmable quad-PLL clock generator, USB 2.0 ULPI transceiver, Gigabit Ethernet PHY, 4 LEDs
Module connectors2 × 100-pin and 1 × 60-pin low-profile Razor Beam connectors
Dimensions4 × 5 cm
Component temperature range−40°C to +85°C; usable module range depends on design and cooling


3) Tech Support/Dokuments

Web available technical information usually covers module features, configuration details, design support files, and reference designs. There are carrier boards available for this module, and current documentation and design resources are offered for download. Contact Mirifica Industrial for further detailed information for your project. 

4) Related Product Suggestion

Compatible TE0820 carrier boards are available as development and integration platforms. 

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 × TE0820-05-3BI81ML MPSoC module with AMD Zynq UltraScale+ ZU3EG, low-profile 2.5 mm socket headers