Description and Technical Data:
1) Overview/Key Features
The TE0720-04-61Q33ML is a low-profile 4 × 5 cm system-on-module built around the AMD Automotive Zynq™ XA7Z020-1CLG484Q. It combines a dual-core ARM Cortex-A9 processing system and programmable logic with 1 GByte of DDR3L SDRAM, 8 GByte of eMMC and 32 MByte of QSPI flash. The module also includes Ethernet and USB 2.0 interfaces, with configurable I/O available through board-to-board connectors. Its low-profile configuration uses 2.5 mm mating-height connectors.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product type | Low-profile system-on-module |
| SoC | AMD Automotive Zynq™ XA7Z020-1CLG484Q |
| Processor | Dual-core ARM Cortex-A9 |
| SoC package | CLG484 |
| Speed grade | -1Q |
| Module dimensions | 40 mm × 50 mm |
| DDR memory | 1 GByte DDR3L SDRAM |
| eMMC storage | 8 GByte |
| QSPI flash | 32 MByte |
| Ethernet | Gigabit Ethernet transceiver |
| USB | USB 2.0 ULPI transceiver |
| I/O | 152 FPGA I/Os and 14 MIOs available on board-to-board connectors |
| Connectors | 2 × 100-pin and 1 × 60-pin low-profile board-to-board connectors |
| Connector mating height | 2.5 mm |
| Operating temperature | -40°C to +85°C |
3) Tech Support/Documents
Web available technical information usually covers the technical reference manual, reference designs, design and advisory notes, product change notifications, firmware, module integration guidance, connector information and pinout/tracelength data. There are the following technical documentation and support resources for the TE0720 module family. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
- TE0703-07 carrier board
- TE0706-04 carrier board
- Spring-loaded heat sink for TE0720 modules
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0720-04-61Q33ML SoC module