Description and Technical Data:
1) Overview/Key Features
The TE0720-04-62I33RL is a low-profile, industrial-grade system-on-module built around the AMD Zynq™ XC7Z020-2CLG484I SoC. It combines dual-core ARM Cortex-A9 processing and programmable logic with 1 GByte of DDR3L SDRAM, 8 GByte of eMMC storage and 32 MByte of QSPI flash. Onboard Ethernet and USB 2.0 transceivers and configurable I/O support embedded designs. Its 4 × 5 cm format and low-profile connectors suit space-constrained systems.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| SoC | AMD Zynq™ XC7Z020-2CLG484I |
| Speed grade | -2 |
| Processor | Dual-core ARM Cortex-A9 MPCore |
| DDR3L SDRAM | 1 GByte, 32-bit |
| eMMC storage | 8 GByte |
| QSPI flash | 32 MByte |
| Ethernet | Gigabit Ethernet PHY |
| USB | USB 2.0 PHY |
| Board-to-board connectors | High-speed stacking connectors; low-profile module variant |
| Module dimensions | 50 × 40 mm |
| PCB thickness | 1.6 mm ±10% |
| Mating height | 8 mm with standard connectors |
| Operating temperature range | Industrial grade: −40 °C to +85 °C; actual operating temperature depends on the design and cooling solution |
3) Tech Support/Documents
Web available technical information usually covers the module’s SoC, memory, interfaces, power requirements, physical dimensions and integration guidance. There are the following development resources: technical reference documentation, reference designs, product change notifications, design and advisory notes, CPLD firmware information and carrier-board resources.
Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
- Spring-loaded heat sink for TE0720-series modules.
- Compatible 4 × 5 cm carrier boards.
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0720-04-62I33RL low-profile 4 × 5 cm SoC module with AMD Zynq™ 7020