Description and Technical Data:
1) Overview/Key Features
The TE0729-03-62I63MAK is an industrial-grade SoC module with a pre-assembled heat spreader. It features an AMD Zynq™ XC7Z020-2CLG484I and combines a dual-core ARM Cortex-A9 processor with FPGA logic in a 5.2 × 7.6 cm form factor.
Onboard resources include 512 MByte of 16-bit DDR3L SDRAM, 32 MByte QSPI flash, 8 GByte e.MMC, 1 Gigabit Ethernet transceiver, 2 10/100 Mbit Ethernet PHYs, and a USB 2.0 High-Speed ULPI transceiver with OTG support. The module also provides 136 FPGA I/Os, 6 PS MIOs, RTC, system management, AES and eFUSE bitstream encryption, and high-speed board-to-board connectors. Component temperature range is −40°C to +85°C; module operating temperature depends on the design and cooling solution.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| SoC | AMD Zynq™ XC7Z020-2CLG484I |
| Speed grade | −2 |
| Architecture / family / type | 7 Series / Zynq / SoC |
| Processor | Dual-core ARM Cortex-A9 MPCore™ with CoreSight™ |
| DDR memory | 512 MByte, 16-bit DDR3L SDRAM |
| QSPI flash | 32 MByte |
| e.MMC storage | 8 GByte |
| Serial EEPROM | 3 × 2 Kbit, with EUI-48 node identity |
| Ethernet | 1 × 10/100/1000 Mbps PHY; 2 × 10/100 Mbps PHYs |
| USB | USB 2.0 High-Speed ULPI transceiver with full OTG support |
| FPGA I/O | 136 I/Os; up to 58 LVDS pairs possible |
| PS MIO | 6 |
| Board-to-board connectors | 2 × 120-pin connectors |
| Power rails | 4.0 A at 1.0 V; 1.5 A at 1.5 V; 1.5 A at 1.8 V; 1.5 A at 2.5 V |
| Form factor | 5.2 × 7.6 cm |
| Component temperature range | −40°C to +85°C |
| Cooling | Pre-assembled heat spreader |
3) Tech Support/Documents
Web available technical information usually covers module specifications, design support files, reference designs, and resources for compatible carrier boards. There are the following support resources: online documentation, downloadable design files, reference designs with source files, and a support forum. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
The TEB0729 carrier board is designed for use with the TE0729 module family.
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0729-03-62I63MAK SoC module with AMD Zynq™ 7020
- 1 x mounted heat spreader (KK0729-03)