Description and Technical Data:
1) Overview/Key Features
TE0803-04-2AE11-A is a 5.2 × 7.6 cm MPSoC module featuring the AMD Zynq™ UltraScale+™ ZU2CG-1E. It combines processing and programmable logic with 2 GByte DDR4 memory and 128 MByte QSPI Boot Flash. The module is designed for integration with a compatible carrier board.
- High-speed board-to-board connectors
- Onboard power management
- Extended-temperature components rated from 0°C to +85°C; the operating range depends on the design and cooling solution
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| MPSoC | AMD Zynq™ UltraScale+™ XCZU2CG-1SFVC784E |
| DDR memory | 2 GByte DDR4 SDRAM |
| Boot Flash | 128 MByte QSPI |
| Form factor | 52 × 76 mm (5.2 × 7.6 cm) |
| Connector type | Board-to-board |
| Component temperature range | 0°C to +85°C |
| Module operating temperature | Depends on design and cooling solution |
3) Tech Support/Documents
Web available technical information usually covers module specifications, technical reference documentation, design files, reference designs, and support information. There are the following resources: TE0803 technical documentation, test-board documentation, starter-kit designs, and support forum. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
The TEBF0808 UltraITX+ baseboard is developed for TE0803 modules. The TE0803 Heat Spreader is a compatible cooling accessory; select cooling based on your design and thermal requirements.
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x product