Description and Technical Data:
1) Overview/Key Features
The TE0803-04-3AE11-AK is a 5.2 × 7.6 cm MPSoC module based on the AMD Zynq™ UltraScale+™ XCZU3CG-1SFVC784E, supplied with a pre-assembled heat spreader. It combines programmable logic and an ARM-based processing system with 2 GByte DDR4 SDRAM and 128 MByte QSPI boot flash. High-speed board-to-board connectors provide configurable I/O for embedded computing and FPGA-based applications.
- AMD Zynq™ UltraScale+™ ZU3CG-1E MPSoC
- 2 GByte DDR4 SDRAM
- 128 MByte QSPI boot flash
- 5.2 × 7.6 cm module format
- Pre-assembled heat spreader included
- High-speed board-to-board connectivity and configurable I/O
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product code | TE0803-04-3AE11-AK |
| MPSoC | AMD Zynq™ UltraScale+™ XCZU3CG-1SFVC784E |
| Speed grade | -1 |
| Temperature grade | Extended |
| DDR4 SDRAM | 2 GByte, 64-bit data bus |
| QSPI boot flash | 128 MByte |
| Board-to-board connectors | 4 × 160-pin high-speed connectors |
| Module dimensions | 52 × 76 mm |
| Cooling | Pre-assembled heat spreader |
3) Tech Support/Documents
Web available technical information usually covers the TE0803 technical reference manual, hardware design resources, reference projects, and application notes. There are the following resources for module integration and development. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
- UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0803-04-3AE11-A module with pre-assembled heat spreader