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Trenz Electronics

MPSoC Module with AMD Zynq™ UltraScale+™ ZU7CG-1I, 4 GByte DDR4, 5.2 x 7.6 cm (TE0807-04-7AI81-A)

TE0807-04-7AI81-A is a compact industrial-grade MPSoC module based on the AMD Zynq™ UltraScale+™ ZU7CG.

2,104.00 € 2,104.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The TE0807-04-7AI81-A is a compact industrial-grade MPSoC module based on the AMD Zynq™ UltraScale+™ ZU7CG. It combines programmable logic, processing-system resources, 4 GB DDR4 memory, 128 MB QSPI boot Flash, high-speed serial transceivers, power-management circuitry, and configurable I/O through rugged board-to-board connectors.

Key features include:

  • AMD Zynq™ UltraScale+™ XCZU7CG-1FBVB900I MPSoC
  • Industrial temperature grade
  • Speed grade: -1
  • FBVB900E package
  • 4 GB DDR4 SDRAM
  • 2 × 64 MB QSPI boot Flash
  • 128 MB total QSPI boot Flash
  • 2 Kbit MAC-address serial EEPROM with EUI-48 node identity
  • On-board oscillator
  • 4 × GTR high-speed transceivers
  • 16 × GTH high-speed transceivers
  • Up to 204 programmable-logic I/Os
  • Up to 156 HP I/Os
  • Up to 48 HD I/Os
  • Up to 65 PS MIOs
  • I²C interface
  • JTAG interface
  • 4 × 160-pin Samtec ST5 board-to-board connectors
  • Power supplied through the board-to-board connector
  • On-board switch-mode power supplies for module voltage rails
  • Compact 5.2 × 7.6 cm footprint
  • Components rated for at least -40 °C to +85 °C

The module is suitable for embedded computing, industrial control, communications, high-speed data processing, FPGA-based acceleration, imaging, and other applications requiring substantial programmable-logic and processing-system resources in a compact form factor. The module operating temperature depends on the customer design and cooling solution.

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
Product typeMPSoC module
MPSoC deviceAMD Zynq™ UltraScale+™ XCZU7CG-1FBVB900I
MPSoC familyZynq
MPSoC architectureUltraScale+
MPSoC typeMPSoC
Speed grade-1
Temperature gradeIndustrial
PackageFBVB900E
DDR memory4 GB DDR4 SDRAM
QSPI boot Flash2 × 64 MB
Total QSPI boot Flash128 MB
Identification memory2 Kbit serial EEPROM with EUI-48 node identity
On-board clockingOn-board oscillator
PS GTR transceivers4
PL GTH transceivers16
Programmable-logic I/OUp to 204
PL HP I/OUp to 156
PL HD I/OUp to 48
PS MIOUp to 65
InterfacesI²C and JTAG
Board-to-board connectors4 × 160-pin Samtec ST5 connectors
Module power inputThrough board-to-board connector
Power regulationOn-board switch-mode power supplies
Form factor5.2 × 7.6 cm
Component temperature range-40 °C to +85 °C
Module typePlug-on MPSoC module

The number of available I/Os depends on the module routing and the associated carrier-board design. 

3) Tech Support/Dokuments

Web available technical information usually covers product features, electrical and mechanical characteristics, MPSoC resources, DDR4 memory, QSPI boot memory, high-speed transceivers, board-to-board interfaces, power architecture, reference designs, and software-development resources.

There are the following technical resources:

  • TE0807 product documentation
  • TE0807 Wiki documentation
  • Hardware design-support files
  • Schematics and assembly documentation
  • Mechanical and dimensional information
  • Reference designs with source files
  • TE0807 StarterKit Linux Design resources
  • Vivado design files
  • Basic Linux and peripheral examples
  • Boot and configuration resources
  • DDR4 and transceiver design information
  • Product-change information
  • Support forum resources
  • Vivado Standard Edition information

Contact Mirifica Industrial for further detailed information for your project.

4) Related Product Suggestion

The following related products and development resources are identified in the product information:

  • TE0807 base board
  • TE0807 StarterKit with TEBF0808 carrier board
  • TE0817 module series, recommended for new projects because of its improved connector design

A compatible base or carrier board is required for practical development and for access to the module’s power, I/O, JTAG, and high-speed interfaces. 

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 x TE0807-04-7AI81-A MPSoC module with AMD Zynq™ UltraScale+™ ZU7CG