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Trenz Electronics

MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E incl. Heat Spreader (TE0807-04-7DE81-AK)

TE0807-04-7DE81-AK is a compact MPSoC module based on the AMD Zynq™ UltraScale+™ ZU7EV-1E.

1,879.00 € 1,879.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The TE0807-04-7DE81-AK is a compact MPSoC module based on the AMD Zynq™ UltraScale+™ ZU7EV-1E. It combines a heterogeneous processing system with programmable logic, integrated graphics and video codec acceleration, DDR4 memory, QSPI boot Flash, high-speed serial transceivers, rugged board-to-board connectivity, and onboard power-management circuitry.

The module is designed for demanding embedded applications such as industrial control, machine vision, video processing, high-speed data acquisition, communications, robotics, and custom FPGA-based computing platforms. This version includes a pre-assembled heat spreader.

Key features:

  • AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E MPSoC
  • -1 speed grade
  • Extended-temperature device
  • Integrated graphics processing unit
  • Integrated video codec unit
  • 4 GB DDR4 SDRAM
  • 2 × 64 MB QSPI boot Flash
  • 2 Kbit serial EEPROM for MAC-address storage and EUI-48 node identity
  • 20 high-speed serial transceivers
  • 4 × PS GTR transceivers
  • 16 × PL GTH transceivers
  • Up to 204 programmable-logic I/Os
  • 156 HP I/Os
  • 48 HD I/Os
  • Up to 65 PS MIOs
  • I²C and JTAG interfaces
  • 4 × 160-pin rugged high-speed board-to-board connectors
  • Switch-mode power supplies for the onboard voltage rails
  • Power supplied through the board-to-board connector
  • Compact 5.2 × 7.6 cm form factor
  • Pre-assembled heat spreader
  • Component temperature range of 0°C to +85°C; actual module operating temperature depends on the customer design and cooling solution

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
Product typeMPSoC module with pre-assembled heat spreader
MPSoC deviceAMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E
Zynq deviceZU7EV-1E
Speed grade-1
Device packageFBVB900
FPGA/SoC architectureUltraScale+
FPGA/SoC familyZynq
FPGA/SoC typeMPSoC
Processing systemARM-based Zynq UltraScale+ processing system
Graphics processingIntegrated GPU
Video processingIntegrated video codec unit
DDR4 SDRAM4 GB
QSPI boot Flash2 × 64 MB
Total QSPI boot Flash capacity128 MB
MAC-address memory2 Kbit serial EEPROM with EUI-48 node identity
High-speed serial transceivers20
PS GTR transceivers4
PL GTH transceivers16
Programmable-logic I/OsUp to 204
HP I/Os156
HD I/Os48
PS MIOsUp to 65
InterfacesI²C and JTAG
Board-to-board connectors4 × 160-pin ST5 connectors
Power inputVia board-to-board connector
Power managementOnboard switch-mode power supplies
Form factor5.2 × 7.6 cm
CoolingPre-assembled heat spreader
Component temperature range0°C to +85°C
Module operating temperatureDependent on customer design and cooling solution

3) Tech Support/Dokuments

Web available technical information usually covers the TE0807 module family, including the technical reference manual, schematics, pinout documentation, connector information, mechanical data, reference designs, design-support files, configuration files, software guidance, and carrier-board integration information.

There are the following technical support resources:

  • Technical Reference Manual
  • Hardware design files
  • Schematics and assembly documentation
  • Pinout and board-to-board connector information
  • Mechanical and 3D design data
  • Reference designs with source files
  • FPGA design-support files
  • Configuration and firmware files
  • Linux and embedded-software guidance
  • Vivado Standard Edition design support
  • Carrier-board integration information
  • Product Change Notification documentation
  • Technical support forum

Contact Mirifica Industrial for further detailed information for your project.

4) Related Product Suggestion

  • TEBF0808-05 — UltraITX+ baseboard developed for TE0803, TE0807, and TE0808 UltraSOM+ MPSoC modules. It provides a development and integration platform for the TE0807 module family.

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 x TE0807-04-7DE81-A MPSoC module with AMD Zynq™ UltraScale+™ ZU7EV
  • 1 x mounted heat spreader for TE0807, article no. KK0807-04