Description and Technical Data:
1) Overview/Key Features
The TE0808-05-9GI81-E is a compact UltraSOM+ MPSoC module based on the AMD Zynq™ UltraScale+™ ZU9EG-2I device. It combines programmable logic, embedded processing, high-speed transceivers, DDR4 memory, configuration flash, clocking, and power-management circuitry on a 5.2 × 7.6 cm system-on-module.
Key features include:
- AMD Zynq™ UltraScale+™ XCZU9EG-2FFVC900I MPSoC
- Industrial temperature-grade device
- 4 GByte DDR4 SDRAM
- 128 MByte SPI boot flash
- 2 Kbit serial EEPROM with EUI-48 node identity
- 20 high-speed serial transceivers
204 programmable-logic I/O lines:
- 156 HP I/O
- 48 HD I/O
- 65 PS MIO interfaces
- 4 PS GTR interfaces
- 16 PL GTH interfaces
- 4 × 160-pin board-to-board connectors
- Integrated PLL clock generator
- Separately controlled power domains for LP, FP, and PL sections
- Suitable for FPGA acceleration, embedded vision, industrial control, communications, robotics, and high-performance embedded systems
The module requires a 3.3 V supply through the board-to-board connector and must be used with a suitable carrier board. Because this is revision TE0808-05, mechanical compatibility and cooling should be checked when replacing earlier TE0808 revisions. The product page also recommends considering the TE0818 series for new designs because of its improved connector arrangement.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| SoC/FPGA device | AMD Zynq™ UltraScale+™ XCZU9EG-2FFVC900I |
| Device speed grade | -2I |
| Device temperature grade | Industrial |
| MPSoC family | Zynq™ UltraScale+™ |
| Package | FFVC900 |
| Module type | UltraSOM+ MPSoC module |
| DDR4 memory | 4 GByte DDR4 SDRAM |
| Boot/configuration memory | 2 × 64 MByte SPI boot flash, dual parallel |
| Serial EEPROM | 2 Kbit EEPROM with EUI-48 node identity |
| Board-to-board connectors | 4 × 160-pin B2B connectors |
| Programmable-logic I/O | 204 PL I/O |
| PL HP I/O | 156 |
| PL HD I/O | 48 |
| Processing-system MIO | 65 PS MIO |
| PS transceivers | 4 PS GTR |
| PL transceivers | 16 PL GTH |
| High-speed serial transceivers | 20 total |
| Clocking | On-board oscillator and PLL clock generator |
| Clock outputs/inputs | Transceiver clock inputs and outputs |
| Power input | 3.3 V via board-to-board connector |
| Power domains | Separately controlled LP, FP, and PL power domains |
| Module dimensions | 5.2 × 7.6 cm |
| Form factor | Compact system-on-module, smaller than a credit card |
| Required host hardware | Compatible carrier board |
| Cooling | Application-dependent; verify thermal performance for the target design |
| Product identification | TE0808-05-9GI81-E |
The operating temperature of the complete module depends on the customer design, workload, carrier board, and cooling solution. All components are specified for at least the industrial temperature range of -40 °C to +85 °C, subject to the final system design and thermal conditions.
3) Tech Support/Dokuments
Technical development support is available through the TE0808 documentation ecosystem, including design-support files, reference designs, source files, carrier-board information, and online documentation.
Recommended support resources include:
- TE0808 online documentation and Wiki
- TE0808 Starter Kit documentation
- TE0808 carrier-board documentation
- Pinout and interface information
- Reference designs and source files
- Product Change Notifications
- Technical support forum
- Support contact for hardware and design questions
Designers integrating this module into an existing carrier board should review the applicable revision documentation. In particular, the TE0808-05 revision can differ mechanically from earlier versions, and later revision changes may affect DDR4 timing, power circuitry, thermal materials, or carrier-board compatibility.
4) Related Product Suggestion
TE0818 UltraSOM+ MPSoC module series
The TE0818 series is a suitable alternative for new designs that require a similar Zynq™ UltraScale+™ MPSoC-based architecture but benefit from an improved connector solution. It should be evaluated when designing a new carrier board or when long-term mechanical and interface compatibility are important.
For a complete development platform, consider pairing the appropriate TE0808 module variant with the TEBF0808 carrier board and the corresponding TE0808 Starter Kit documentation. Confirm device variant, memory capacity, connector configuration, thermal requirements, and interface allocation before ordering.
5) Downloads/Links
- Product page – TE0808-05-9GI81-E
- TE0808 Starter Kit documentation
- TE0808-05 PLL, DCDC and DDR update PCN
- TE0808-05 to TE0808-06 hardware revision information
- TE0808 cooler hardware information
- TE0808 gap-filler update
- Technical support forum
- Main TE0808 information page
Software development generally uses AMD Vivado Enterprise Edition, which supports the applicable Zynq™ UltraScale+™ devices.
6) What is in the package
- 1 × TE0808-05-9GI81-E UltraSOM+ MPSoC module with AMD Zynq™ UltraScale+™ ZU9EG-2I
- 4 GByte DDR4 SDRAM fitted on the module
- 128 MByte SPI boot flash fitted on the module
A carrier board, heatsink, cables, power supply, programming adapter, and other development accessories are not listed as included with the module and should be ordered separately where required.