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Trenz Electronics

UltraSOM+ MPSoC-Module with AMD Zynq™ UltraScale+™ ZU9EG-2I incl. Heat Spreader (TE0808-05-9GI81-EK)

1,614.00 € 1,614.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The TE0808-05-9GI81-EK is an UltraSOM+ MPSoC module based on the AMD Zynq™ UltraScale+™ ZU9EG-2I. It combines a high-performance MPSoC, 4 GByte DDR4 SDRAM, 128 MByte of SPI boot flash, high-speed serial transceivers, programmable clocking, and onboard power management in a compact 5.2 cm × 7.6 cm module.

This version includes a mounted KK0808-05 heat spreader and is designed for embedded processing, industrial control, high-performance computing, image processing, communications, and FPGA-based system development. The module provides a large number of configurable I/O signals through rugged high-speed stacking connectors.

Key features include:

  • AMD Zynq™ UltraScale+™ XCZU9EG-2FFVC900I MPSoC
  • -2 speed grade
  • Industrial temperature-grade device
  • Operating temperature range of -40 °C to +85 °C, depending on system design and cooling
  • 4 GByte DDR4 SDRAM
  • 2 × 64 MByte SPI boot flash in dual-parallel configuration
  • 2-Kbit serial EEPROM with EUI-48 node identity
  • 16 × PL-GTH serial transceivers
  • 4 × PS-GTR serial transceivers
  • 204 × PL I/O
  • 156 × HP I/O
  • 48 × HD I/O
  • 65 × PS MIO
  • 4 × PS-GTR interfaces
  • 4 × 160-pin board-to-board connectors
  • Programmable PLL clock generator
  • 2 transceiver clock inputs
  • Separately controlled LP, FP, and PL power domains
  • I²C, JTAG, and configuration interfaces
  • 3.3 V power input through the board-to-board connectors
  • Compact 5.2 cm × 7.6 cm form factor
  • Mounted KK0808-05 heat spreader

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
Module typeUltraSOM+ MPSoC module
SoC familyZynq™ UltraScale+™
MPSoC deviceXCZU9EG-2FFVC900I
Speed grade-2
PackageFFVC900
Temperature gradeIndustrial
Temperature range-40 °C to +85 °C, subject to system design and cooling
Module dimensions5.2 cm × 7.6 cm
DDR4 memory4 GByte
SPI boot flash2 × 64 MByte
SPI configurationDual-parallel
Serial EEPROM2-Kbit with EUI-48 node identity
Board-to-board connectors4 × 160-pin connectors
PL I/O204
HP I/O156
HD I/O48
PS MIO65
PS-GTR interfaces4
PL-GTH transceivers16
Transceiver clocks2
ClockingProgrammable PLL clock generator
InterfacesI²C, JTAG, and configuration
Power input3.3 V through board-to-board connectors
Power domainsLP, FP, and PL domains separately controlled
Onboard oscillatorIncluded
Heat spreaderKK0808-05 mounted
Cooling requirementDepends on customer design and cooling solution

3) Tech Support/Documents

Web available technical information usually covers the MPSoC device, DDR4 memory, SPI boot flash, serial EEPROM, high-speed transceivers, configurable I/O, board-to-board connectors, clock generation, power domains, connector interfaces, module dimensions, and thermal considerations. There are the following technical resources and support options: a compatible base board, module documentation, design support files, reference designs with source files, recommended FPGA development software, product-family information, and support forum assistance.

Vivado Enterprise Edition is recommended for designs using the supported AMD devices. The module’s configuration and operating requirements should be evaluated together with the selected base board, application design, and cooling solution.

Contact Mirifica Industrial for further detailed information for your project.

4) Related Product Suggestion

  • Compatible base board for the TE0808 module
  • TE0818 module series as a recommended alternative for new projects requiring an improved connector solution

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 x TE0808-05-9GI81-E MPSoC module with AMD Zynq™ UltraScale+™ ZU9EG
  • 1 x mounted KK0808-05 heat spreader