Description and Technical Data:
1) Overview/Key Features
The TE0813-02-4BE81-AK is a 5.2 × 7.6 cm MPSoC module based on the AMD Zynq™ UltraScale+™ ZU4EG-1E. It includes 4 GByte of DDR4 SDRAM, 128 MByte of QSPI Boot Flash, and a pre-assembled heat spreader. The module provides configurable I/O through high-speed stacking connectors and uses a 3.3 V power supply.
Key features include:
- AMD Zynq™ UltraScale+™ XCZU4EG-1SFVC784E
- 4 GByte DDR4 SDRAM
- 128 MByte QSPI Boot Flash
- Pre-assembled heat spreader
- 3.3 V supply input
- 4 × 240-pin board-to-board connectors
- 52 × 76 mm form factor
- Component temperature range of 0°C to +85°C
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product | TE0813-02-4BE81-AK MPSoC module with heat spreader |
| MPSoC | AMD Zynq™ UltraScale+™ XCZU4EG-1SFVC784E |
| Speed grade | -1E |
| DDR memory | 4 GByte DDR4 SDRAM |
| Boot Flash | 128 MByte QSPI |
| Connectors | 4 × 240-pin Samtec ADM6 connectors |
| Power supply | 3.3 V |
| Dimensions | 52 × 76 mm |
| Temperature range | 0°C to +85°C |
| Cooling | Pre-assembled heat spreader |
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3) Tech Support/Documents
Web available technical information usually covers module features, memory and I/O, power requirements, dimensions, and system integration. There are the following resources: a product datasheet, module documentation, assembly information, and reference-design materials. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
The TEBF0818-02A UltraITX+ baseboard is listed as compatible with the TE0813 module family.
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0813-02-4BE81-AK MPSoC module with pre-assembled heat spreader