Description and Technical Data:
1) Overview/Key Features
The TE0817-02-7AI81-A is a compact, industrial-temperature MPSoC module based on the AMD Zynq™ UltraScale+™ XCZU7CG-1FBVB900I. It combines an ARM-based processing system with programmable logic, high-speed serial connectivity, 4 GByte of DDR4 SDRAM, configuration flash, power-management circuitry, and high-density board-to-board interfaces.
With a 5.2 × 7.6 cm footprint, the module is suitable for embedded computing, industrial automation, robotics, communications, machine vision, high-speed data acquisition, measurement equipment, and FPGA-accelerated edge-processing applications.
Key features include:
- AMD Zynq™ UltraScale+™ XCZU7CG-1FBVB900I MPSoC
- Industrial temperature grade
- 4 GByte DDR4 SDRAM
- 128 MByte QSPI boot flash
- 2 Kbit serial EEPROM with EUI-48 node identity
- 20 high-speed serial transceivers
- 16 GTH transceivers
- 4 GTR transceivers
- Up to 204 programmable-logic I/Os
- Up to 156 high-performance I/Os
- Up to 48 high-density I/Os
- Up to 65 processing-system MIO connections
- 4 × 160-pin high-speed board-to-board connectors
- I²C and JTAG interfaces
- On-board oscillator
- On-board switch-mode power supplies
- Power supplied through the board-to-board connectors
- Rugged Samtec BGA-based connector system
- 5.2 × 7.6 cm module dimensions
- Component temperature range of -40°C to +85°C
The TE0817 is largely identical in construction to the TE0807, but uses a newer high-reliability Samtec BGA connector system. A compatible carrier or baseboard is required to provide power, programming, debugging, and access to the module’s interfaces. The module operating temperature in the completed system depends on the customer design and cooling solution.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| MPSoC device | AMD Zynq™ UltraScale+™ XCZU7CG-1FBVB900I |
| Device speed grade | -1 |
| Temperature grade | Industrial |
| Device package | FBVB900I |
| Device architecture | UltraScale+™ |
| Device family | Zynq™ |
| Device type | MPSoC |
| DDR4 memory | 4 GByte DDR4 SDRAM |
| Configuration memory | 128 MByte QSPI boot flash |
| Identity memory | 2 Kbit serial EEPROM with EUI-48 node identity |
| High-speed serial transceivers | 20 total |
| GTH transceivers | 16 |
| GTR transceivers | 4 |
| Programmable-logic I/O | Up to 204 |
| High-performance I/O | Up to 156 HP I/Os |
| High-density I/O | Up to 48 HD I/Os |
| Processing-system I/O | Up to 65 PS MIO connections |
| Board-to-board connectors | 4 × 160-pin high-speed connectors |
| Connector technology | Samtec BGA-based high-speed connectors |
| Interfaces | I²C and JTAG |
| On-board clock source | Oscillator |
| Power architecture | On-board switch-mode power supplies |
| Power input | Via board-to-board connectors |
| Component temperature range | -40°C to +85°C |
| Module dimensions | 5.2 × 7.6 cm |
| Form factor | 5.2 × 7.6 cm |
The stated I/O counts represent the available maximum resources. The signals exposed and their electrical configuration depend on the carrier-board design, pin assignment, voltage configuration, and application requirements.
3) Tech Support/Dokuments
The TE0817 platform is supported by product documentation, design-support files, reference designs, and source files available through the associated technical resources.
Recommended development resources include:
- Vivado Standard Edition for basic development
- Vivado Enterprise Edition where advanced device features or implementation requirements apply
- TE0817 technical documentation
- Module schematics and hardware design information
- Reference designs and source files
- Mechanical drawings and connector information
- Product Change Notification documentation
- Compatible baseboard documentation
- JTAG and configuration guidance
- Technical support forum resources
A baseboard is available for the module. The product documentation also indicates that design-support files and reference designs with source files are available for download.
4) Related Product Suggestion
A TE0817-compatible baseboard or carrier board is the recommended companion product. It provides regulated power, JTAG access, configuration support, external connectors, and routing for the module’s programmable-logic I/O and high-speed transceivers.
When selecting a baseboard, verify:
- Compatibility with the 5.2 × 7.6 cm module format
- Matching 4 × 160-pin connector arrangement
- Samtec connector type, orientation, and mating height
- Required supply voltages and current capacity
- Support for the required PS MIO and PL I/O signals
- Compatibility with GTH and GTR transceiver routing
- JTAG and boot-configuration access
- Adequate thermal management for the XCZU7CG MPSoC
- Availability of the external interfaces required by the application
A TE0817-series baseboard is preferred for new designs because its connector system is specifically matched to the TE0817 module family.
5) Downloads/Links
- Product page and available downloads
- TE0817 technical wiki
- Technical support forum
- AMD Vivado Design Suite
- AMD Zynq UltraScale+ MPSoC documentation
- TE0817-compatible baseboards
The product page provides access to the latest available documentation, design-support files, reference designs, and related technical resources.
6) What is in the package
The package contains:
- 1 × TE0817-02-7AI81-A MPSoC module with AMD Zynq™ UltraScale+™ ZU7CG
A baseboard or carrier board, power supply, JTAG programmer, heatsink, cables, and other development accessories are not included unless specifically listed as part of a separate kit or configuration.