Description and Technical Data:
1) Overview/Key Features
The TE0821-02-3AE91PA is an industrial-grade MPSoC module built around the AMD Zynq™ UltraScale+™ ZU3CG-1E. It integrates 4 GByte DDR4 SDRAM, 128 MByte flash memory, and 64 GByte eMMC storage, with onboard power supplies and configurable I/O exposed through rugged high-speed stacking connectors. The 4 × 5 cm module is pin-compatible with TE0820 modules, with JM2 pin 100 not connected. Components are specified for an extended temperature range of 0°C to +85°C; the operating range depends on the system design and cooling solution. trenz-electronic.de
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Module | TE0821-02-3AE91PA |
| SoC | AMD Zynq™ UltraScale+™ XCZU3CG-1SFVC784E |
| DDR4 SDRAM | 4 GByte |
| Flash memory | 128 MByte |
| eMMC | 64 GByte |
| Form factor | 4 × 5 cm |
| I/O | Configurable I/O via high-speed stacking connectors |
| Compatibility | Pin-compatible with TE0820 modules; JM2 pin 100 is not connected |
| Component temperature range | 0°C to +85°C |
| Operating temperature | Depends on system design and cooling solution |
3) Tech Support/Documents
Web available technical information usually covers module specifications, integration guidance, technical reference documentation, design support files, and reference designs with source files. There are the following resources: technical manuals, reference designs, design notes, and carrier-board options. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
A spring-loaded heat sink is listed for the TE0820/TE0821 module series. Compatible 4 × 5 cm carrier-board options are also available.
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0821-02-3AE91PA MPSoC module with AMD Zynq™ UltraScale+™ ZU3CG
- 8 x screws
- 4 x bolts