Description and Technical Data:
1) Overview/Key Features
The TE0841-03-41C31-A is a compact 4 × 5 cm FPGA micromodule built around the AMD Kintex™ UltraScale™ XCKU040-1SFVA784C. It combines high-performance programmable logic, 2 GByte of DDR4 SDRAM, configuration flash, integrated power regulation, clock generation, and high-density board-to-board connectivity in a rugged module designed for embedded and industrial applications.
Key features include:
- AMD Kintex™ UltraScale™ XCKU040-1SFVA784C FPGA
- 2 GByte DDR4 SDRAM using 2 × 1 GByte memory banks
- 32-bit DDR4 memory interface, with separate 16-bit interfaces
- 64 MByte QSPI boot flash
- 40 × 50 mm module footprint
- 3.2 mm mounting holes
- 260 total board-to-board terminals
- 60 high-range I/Os and 84 high-performance I/Os
- 8 GTH serial-transceiver lanes
- 2 external multi-gigabit-transceiver clock inputs
- Si5338 clock generator with 4-output PLL
- 200 MHz LVDS oscillator for programmable logic and transceiver clocking
- On-board power supplies supporting single-supply operation
- User-defined I/O-bank voltage capability
- Evenly distributed supply pins to support signal integrity
- Commercial temperature range of 0°C to +70°C
- Compatible with the 4 × 5 cm module ecosystem when the mechanical and electrical requirements are met
The module is suitable for FPGA-based acceleration, high-speed data processing, industrial control, communications, measurement equipment, imaging, and custom embedded computing platforms. A suitable carrier or baseboard is required for system integration and external I/O access. The manufacturer’s page identifies the module’s predecessor as TE0841-02-41C21-A and indicates that changes are documented through a product change notification.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| FPGA device | AMD Kintex™ UltraScale™ XCKU040-1SFVA784C |
| FPGA architecture | UltraScale™ |
| FPGA family | Kintex™ |
| FPGA type | FPGA |
| Module dimensions | 40 × 50 mm |
| Mounting holes | 3.2 mm |
| DDR4 memory | 2 GByte total |
| DDR4 organization | 2 × 1 GByte banks |
| DDR4 interface | 32-bit total; each memory bank uses a separate 16-bit interface |
| Configuration memory | 64 MByte QSPI boot flash |
| Board-to-board connectors | 3 × high-speed hermaphroditic terminal/socket strips |
| Connector pitch or height | Regular 4 mm configuration |
| Total connector terminals | 260 |
| High-range I/O resources | 60 HR I/Os |
| High-performance I/O resources | 84 HP I/Os |
| Serial transceivers | 8 GTH lanes, TX/RX |
| External transceiver clocks | 2 MGT external clock inputs |
| Clock generator | Si5338, 4-output PLL |
| On-board oscillator | 200 MHz LVDS oscillator |
| Power architecture | On-board switch-mode power supplies |
| Supply operation | Single-supply operation supported |
| I/O-bank power | User-defined I/O-bank power |
| Operating temperature classification | Commercial, 0°C to +70°C |
| Form factor | 4 × 5 cm |
The module’s actual operating temperature in an installed system depends on the customer design, carrier-board implementation, airflow, enclosure, and cooling solution.
3) Tech Support/Dokuments
Development support is available through the product documentation, reference designs, design files, and technical support resources associated with the TE0841 family.
Recommended development resources include:
- Vivado Enterprise Edition for AMD Kintex™ UltraScale™ device development
- TE0841 technical documentation and module reference information
- Hardware design files and schematics, where provided
- Reference designs and source files
- Product Change Notification documentation for design revisions
- Compatibility information for 4 × 5 cm carrier and baseboard solutions
- Connector documentation for the high-speed board-to-board interface
- Technical support forum and manufacturer support channels
Vivado Enterprise Edition is identified as the recommended software environment because it supports the full range of AMD FPGA devices used with this type of module.
4) Related Product Suggestion
A compatible 4 × 5 cm carrier board is the most appropriate companion product for the TE0841-03-41C31-A. A carrier board provides power input, programming access, user connectors, test points, and interfaces for bringing the module’s FPGA I/O and high-speed transceivers into a complete development or embedded system.
When selecting a carrier board, confirm:
- Mechanical compatibility with the 40 × 50 mm module
- Matching high-speed connector arrangement and mating height
- Required I/O-bank voltage support
- Availability of programming and debugging interfaces
- Support for the required GTH transceiver routing
- Adequate power capacity and thermal management
- Compatibility with the intended DDR4 and clocking configuration
A suitable product category to evaluate is a Trenz Electronic carrier board for 4 × 5 cm modules, such as the TE0701-07-A family. Compatibility should be confirmed against the specific TE0841-03-41C31-A revision before purchase or system design.
5) Downloads/Links
- Product page and technical downloads
- TE0841 product documentation and design resources
- Trenz Electronic support forum
- AMD Vivado Design Suite
- AMD Kintex UltraScale documentation
- 4 × 5 cm carrier-board product category
The product page provides access to the latest available support files, design documentation, reference materials, and downloadable resources. 6) What is in the package
The package contains:
- 1 × TE0841-03-41C31-A 4 × 5 cm FPGA micromodule with AMD Kintex™ UltraScale™ XCKU040 FPGA and commercial-temperature components
- 8 × screws
- 4 × bolts
A carrier board, power supply, programming adapter, heatsink, and other system accessories are not included unless specifically listed as part of a separate kit or configuration.