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Trenz Electronics

MPSoC Modul wit Zynq™ UltraScale+™ ZU17EG-2I, 4 GB DDR4 ECC (PS), 4 GB DDR4 (PL) (TE0865-02-DGI83MA)

TE0865-02-DGI83MA is a high-performance MPSoC module based on the AMD Zynq™ UltraScale+™ XCZU17EG-2FFVC1760I.

5,484.00 € 5,484.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The Trenz Electronic TE0865-02-DGI83MA is a high-performance MPSoC module based on the AMD Zynq™ UltraScale+™ XCZU17EG-2FFVC1760I. It combines a programmable processing system with FPGA fabric, ECC-protected DDR4 memory for the processing system, separate DDR4 memory for the programmable logic, high-speed transceivers, nonvolatile storage, Ethernet, USB, clock-generation circuitry, and a system-controller CPLD.

The module is suitable for embedded computing, industrial automation, machine vision, artificial intelligence, robotics, communications, high-speed data processing, and other applications requiring substantial processing and programmable-logic resources in a compact system-on-module format.

Key features include:

  • AMD Zynq™ UltraScale+™ XCZU17EG-2FFVC1760I MPSoC
  • Industrial-temperature device grade
  • 4 GByte DDR4 SDRAM with ECC for the processing system
  • 4 GByte DDR4 SDRAM for the programmable logic
  • 256 MByte QSPI boot flash
  • 8 GByte e.MMC memory
  • 2 Kbit I²C serial EEPROM with EUI-48™ node identity
  • Intel® MAX® 10 FPGA used as the system-controller CPLD
  • Gigabit Ethernet PHY
  • High-speed USB 2.0 ULPI transceiver with full OTG support
  • 6 MEMS oscillators
  • 102 HD I/Os
  • 256 HP I/Os
  • 27 MIOs
  • 32 PL GTH transceivers
  • 16 PL GTY transceivers
  • 4 PS GTR transceivers
  • 4 Samtec AcceleRate HD board-to-board connectors
  • 12 V input supply
  • Variable bank-I/O power input
  • 7.5 × 10 cm module format

The separate processing-system and programmable-logic memory resources support partitioned software and FPGA workloads, including high-throughput data-processing and industrial-vision designs. The actual operating temperature depends on the module design, carrier board, workload, and cooling solution.

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
ProductTE0865-02-DGI83MA MPSoC module
MPSoC deviceAMD Zynq™ UltraScale+™ XCZU17EG-2FFVC1760I
ArchitectureUltraScale+
Device familyZynq
Device typeMPSoC
Speed grade-2
Temperature gradeIndustrial
Device packageFFVC1760
Processing-system memory4 GByte DDR4 SDRAM with ECC
Programmable-logic memory4 GByte DDR4 SDRAM
QSPI boot flash256 MByte
e.MMC memory8 GByte
MAC-address memory2 Kbit I²C serial EEPROM with EUI-48™ node identity
System controllerIntel® MAX® 10 FPGA used as CPLD
Oscillators6 MEMS oscillators
EthernetGigabit Ethernet PHY
USBHigh-speed USB 2.0 ULPI transceiver with full OTG support
HD I/O102
HP I/O256
MIO27
PL GTH transceivers32
PL GTY transceivers16
PS GTR transceivers4
Board-to-board connectors4 × Samtec AcceleRate HD
Input supply voltage12 V
Bank-I/O supplyVariable bank-I/O power input
Module dimensions7.5 × 10 cm
DDR4 PS configuration5,120 MByte physical memory with ECC; 4 GByte usable capacity
DDR4 PL configuration4,096 MByte
Boot configurationQSPI flash and e.MMC storage

The TE0865-02-DGI83MA uses the TE0865-02 hardware platform and provides 4 GByte ECC-protected DDR4 connected to the processing system and 4 GByte DDR4 connected to the programmable logic.

3) Tech Support/Dokuments

Web available technical information usually covers the TE0865 module architecture, Zynq™ UltraScale+™ MPSoC resources, ECC-protected processing-system memory, programmable-logic memory, QSPI boot flash, e.MMC storage, Ethernet, USB, clocking, power supply, configurable I/O, high-speed transceivers, board-to-board connectors, system-controller functions, carrier-board design, reference designs, and hardware-revision information.

There are the following technical-support resources:

  • TE0865 technical reference documentation
  • TE0865 test-board documentation
  • Reference designs for Vivado, Vitis, and PetaLinux
  • Basic Linux reference design
  • Hardware interface and connector documentation
  • Pinout and I/O assignment information
  • Power-supply and bank-voltage information
  • PCB, mechanical, and STEP-model files
  • Trace-length and signal-integrity information
  • Product Change Notifications
  • AMD Zynq™ UltraScale+™ MPSoC documentation
  • Development-tool documentation
  • Technical-support forum

The TE0865 test board provides a development platform with USB, Ethernet, Firefly, SD-card, and Samtec AcceleRate HD board-to-board interfaces. The applicable TE0865-02 documentation should be used for revision-specific DDR4 timing, power, and hardware information.

Contact Mirifica Industrial for further detailed information for your project.

4) Related Product Suggestion

  • TEBT0865-01 test board for TE0865 MPSoC modules
  • TEB0865-01-A baseboard for TE0865 high-performance MPSoC modules
  • KK0865-02 heat spreader with fan for TE0865-02 modules
  • Compatible TE0865 carrier and test-board solutions
  • AMD development tools for Zynq™ UltraScale+™ MPSoC design

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 x TE0865-02-DGI83MA Trenz Electronic MPSoC module with AMD Zynq™ UltraScale+™ ZU17EG