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Trenz Electronics

MPSoC Module with Zynq™ UltraScale+™ ZU19EG-1I, 4 GB DDR4 ECC(PS), 4 GB DDR4(PL) (TE0865-02-FBI83MA)

TE0865-02-FBI83MA is a high-performance 7.5 × 10 cm MPSoC module based on the AMD Zynq™ UltraScale+™ ZU19EG-1I device.

4,564.00 € 4,564.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The TE0865-02-FBI83MA is a high-performance 7.5 × 10 cm MPSoC module based on the AMD Zynq™ UltraScale+™ ZU19EG-1I device. It combines programmable logic, processing-system memory, high-speed transceivers, storage, Ethernet, USB connectivity, and onboard power management in a rugged plug-on module format.

Key features include:

  • AMD Zynq™ UltraScale+™ XCZU19EG-1FFVC1760I MPSoC
  • C1760 package with industrial temperature-grade device
  • 4 GB DDR4 SDRAM with ECC on the processing system
  • 4 GB DDR4 SDRAM on the programmable logic side
  • 2 × 128 MB SPI boot Flash in dual-parallel configuration
  • 8 GB e.MMC memory
  • 2 Kbit MAC-address serial EEPROM with EUI-48 node identity
  • Onboard Intel® MAX® 10 FPGA used as a system-controller CPLD
  • 6 × MEMS oscillators
  • Gigabit Ethernet transceiver PHY
  • High-speed USB 2.0 ULPI transceiver with full OTG support
  • 96 HD I/Os, 240 HP I/Os, and 21 MIOs
  • 32 × PL GTH, 16 × PL GTY, and 4 × PS GTR transceivers
  • 4 × Samtec AcceleRate HD board-to-board connectors
  • 12 V input supply with variable bank I/O power input
  • Rugged construction suitable for demanding embedded applications
  • Module dimensions of 7.5 × 10 cm
  • Industrial-grade component temperature range of -40°C to +85°C; actual operating temperature depends on the customer design and cooling solution

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
Product typeMPSoC module
SoC/FPGA deviceAMD Zynq™ UltraScale+™ XCZU19EG-1FFVC1760I
Zynq deviceZU19EG-1I
Speed grade-1
Device packageC1760
FPGA/SoC architectureUltraScale+
FPGA/SoC familyZynq
FPGA/SoC typeMPSoC
Processing-system memory4 GB DDR4 SDRAM with ECC
Programmable-logic memory4 GB DDR4 SDRAM
Boot Flash2 × 128 MB SPI Flash, dual parallel
e.MMC memory8 GB
MAC-address memory2 Kbit serial EEPROM with EUI-48 node identity
System controllerIntel® MAX® 10 FPGA used as CPLD
EthernetGigabit Ethernet transceiver PHY
USBHigh-speed USB 2.0 ULPI transceiver with full OTG support
HD I/O96
HP I/O240
MIO21
PL GTH transceivers32
PL GTY transceivers16
PS GTR transceivers4
Board-to-board connectors4 × Samtec AcceleRate HD
Input supply voltage12 V
Variable I/O powerVariable bank I/O power input
Form factor7.5 × 10 cm
Component temperature range-40°C to +85°C
Graphics processorGPU included in the Zynq UltraScale+ device

3) Tech Support/Dokuments

Web available technical information usually covers the TE0865 module family, including the technical reference manual, reference designs, application notes, CPLD firmware information, product-change documentation, pinout information, connector compatibility, and carrier-board integration guidance.

There are the following technical support resources:

  • Technical Reference Manual
  • TE0865 family documentation
  • Reference designs with source files
  • Application notes
  • CPLD firmware documentation and files
  • Product Change Notification documentation
  • Schematic and design-change information
  • Pinout and trace-length information
  • Board-to-board connector compatibility information
  • Carrier-board integration information
  • Vivado design-suite guidance
  • Technical support forum and direct technical support

Contact Mirifica Industrial for further detailed information for your project.

4) Related Product Suggestion

  • KK0865-02 — Heat spreader with fan designed for TE0865-02 modules.
  • TEBT0865-01 — Testboard for TE0865 MPSoC modules, featuring USB A, Ethernet RJ45, Firefly, SD card holder, and Samtec AcceleRate HD board-to-board connectivity.

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 x TE0865-02-FBI83MA MPSoC module with AMD Zynq™ UltraScale+™ ZU19EG