Description and Technical Data:
1) Overview/Key Features
The TE0715-05-51I33-L is a low-profile, industrial-grade system-on-module built around the AMD Zynq™-7015 XC7Z015-1CLG485I. It combines dual-core ARM Cortex-A9 processing and programmable logic with 1 GByte DDR3L SDRAM and 32 MByte QSPI flash. The module includes Gigabit Ethernet and USB 2.0 transceivers, 4 GTP/GTX transceivers, and configurable I/O on high-speed board-to-board connectors. Its low-profile connectors have a 2.5 mm height.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| SoC | AMD Zynq™ XC7Z015-1CLG485I |
| Speed grade | -1 |
| Temperature grade | Industrial |
| Processor | Dual-core ARM Cortex-A9 MPCore |
| DDR3L SDRAM | 1 GByte, 32-bit |
| Configuration flash | 32 MByte QSPI flash with execute-in-place (XiP) support |
| Ethernet | 10/100/1000 tri-speed Gigabit Ethernet PHY with SGMII |
| USB | USB 2.0 high-speed ULPI transceiver |
| High-speed transceivers | 4 GTP/GTX transceivers |
| Board-to-board connectors | 2 × 100-pin and 1 × 60-pin Razor Beam connectors |
| Connector profile | Low profile, 2.5 mm |
| Available I/O | 132 FPGA I/Os, up to 65 LVDS pairs, and 14 PS-MIO |
| Other features | MAC address EEPROM, programmable clock generator, temperature-compensated RTC, system management, eFUSE and AES bitstream encryption, user LED |
| Module form factor | 4 × 5 cm |
| Module dimensions | 50 × 40 mm |
| Temperature range | −40 °C to +85 °C; module operating temperature depends on the customer design and cooling solution |
3) Tech Support/Documents
Web available technical information usually covers the module’s SoC, memory, interfaces, connectors, I/O and development resources. There are the following development resources: technical documentation, reference designs, design-support files and compatible base boards.
Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
- TE0715-series spring-loaded heat sink.
- Compatible base boards, including TE0701, TE0703, TE0705, TE0706 and TEBA0841-02.
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0715-05-51I33-L 4 × 5 cm SoC module with AMD Zynq™ 7015, low profile, without spacer bolts and screws