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Trenz Electronics

MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm (TE0807-04-7DE81-A)

TE0807-04-7DE81-A is a compact, high-performance MPSoC module based on the AMD Zynq™ UltraScale+™ ZU7EV.

1,849.00 € 1,849.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The TE0807-04-7DE81-A is a compact, high-performance MPSoC module based on the AMD Zynq™ UltraScale+™ ZU7EV. It combines a multicore processing system, programmable logic, graphics processing, video codec functionality, high-speed serial connectivity, DDR4 memory, configuration flash, and power-management circuitry on a 5.2 × 7.6 cm module.

The module is designed for embedded vision, video processing, industrial automation, communications, medical equipment, test and measurement, robotics, edge computing, and other applications requiring integrated processing and FPGA acceleration.

Key features include:

  • AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E MPSoC
  • ARM-based processing system combined with programmable logic
  • Integrated graphics processing unit and video codec unit
  • 4 GByte DDR4 SDRAM
  • 128 MByte configuration flash memory
  • 2 × 64 MByte QSPI boot flash
  • 2 Kbit MAC-address serial EEPROM with EUI-48 node identity
  • 20 high-speed serial transceivers
  • 16 GTH transceiver lanes
  • 4 GTR transceiver lanes
  • Up to 204 programmable-logic I/Os
  • Up to 156 high-performance I/Os
  • Up to 48 high-density I/Os
  • Up to 65 processing-system MIO connections
  • I²C and JTAG interfaces
  • 4 × 160-pin high-speed board-to-board connectors
  • On-board switch-mode power supplies for module voltages
  • Power supplied through the board-to-board connectors
  • Compact 5.2 × 7.6 cm form factor
  • Extended-temperature components rated from 0°C to +85°C
  • Rugged high-density stacking connections for carrier-board integration

The module operating temperature depends on the customer’s design, enclosure, airflow, power consumption, and cooling solution. A compatible baseboard or carrier board is required for power input, programming, debugging, and access to external interfaces. The product page recommends the TE0817 module series for new projects because it uses an improved connector design.

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
MPSoC deviceAMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E
Device speed grade-1E
Device packageFBVB900E
Device architectureUltraScale+™
Device familyZynq™
Device typeMPSoC
Integrated processingARM-based processing system with programmable logic
Graphics capabilityIntegrated graphics processing unit
Video capabilityIntegrated video codec unit
DDR4 memory4 GByte DDR4 SDRAM
Configuration flash128 MByte total QSPI flash
QSPI organization2 × 64 MByte
Identity memory2 Kbit serial EEPROM with EUI-48 node identity
High-speed transceivers20 total
GTH transceivers16
GTR transceivers4
Programmable-logic I/OUp to 204
High-performance I/OUp to 156 HP I/Os
High-density I/OUp to 48 HD I/Os
Processing-system I/OUp to 65 PS MIO connections
Board-to-board connectors4 × 160-pin high-speed connectors
Module interfacesI²C and JTAG
Power architectureOn-board switch-mode power supplies
Power inputVia board-to-board connectors
Module dimensions5.2 × 7.6 cm
Component temperature ratingExtended range, 0°C to +85°C
Article numberTE0807-04-7DE81-A

The stated I/O counts are maximum device and module resources. The usable number and electrical function of individual signals depend on the carrier-board design, pin assignment, voltage configuration, and the selected device interfaces.

3) Tech Support/Dokuments

The TE0807 platform is supported by product documentation, design-support files, reference designs, and source files available through the associated technical resources.

Recommended development resources include:

  • AMD Vivado Standard Edition or Vivado Enterprise Edition
  • TE0807 product documentation
  • Module schematics and hardware design information
  • Board-support and reference-design files
  • Source files for available reference designs
  • Mechanical drawings and connector information
  • Product Change Notification documentation
  • Baseboard documentation
  • Technical support forum resources

Vivado Standard Edition is identified for basic development use, while Vivado Enterprise Edition may be required for advanced device features, larger designs, or specific implementation requirements. The module requires a suitable carrier or baseboard for practical development and system testing.

4) Related Product Suggestion

A compatible 5.2 × 7.6 cm MPSoC carrier or baseboard is the recommended companion product for the TE0807-04-7DE81-A. The baseboard should provide regulated power, JTAG access, configuration support, user connectors, and routing for the required I/O and transceiver interfaces.

When selecting a carrier board, verify:

  • Mechanical compatibility with the 5.2 × 7.6 cm module
  • Matching 4 × 160-pin connector configuration
  • Correct connector mating height and orientation
  • Required power input and current capacity
  • Support for the selected PS MIO and PL I/O signals
  • Compatibility with GTH and GTR transceiver routing
  • DDR4 and boot-configuration requirements
  • Adequate thermal management for the ZU7EV MPSoC
  • Availability of interfaces required by the final application

A TE0807-compatible baseboard is the most direct product recommendation. For new designs, the TE0817 module family may also be evaluated because the product documentation identifies it as having an improved connector arrangement; electrical, mechanical, and software compatibility should be reviewed before considering it as a substitute.

5) Downloads/Links

The product page provides access to the latest available documentation, design-support files, reference designs, and source files.

6) What is in the package

The package contains:

  • 1 × TE0807-04-7DE81-A MPSoC module with AMD Zynq™ UltraScale+™ ZU7EV

A carrier board, power supply, JTAG programmer, heatsink, cables, and other development accessories are not included unless specifically listed as part of a separate kit or configuration.