Description and Technical Data:
1) Overview/Key Features
The TE0813-02-2BE81-A is a 5.2 × 7.6 cm MPSoC module featuring the AMD Zynq™ UltraScale+™ ZU2EG-1E. It integrates 4 GByte DDR4 memory and 128 MByte QSPI boot flash, providing processing and programmable-logic resources in a compact module format for embedded and FPGA-based systems.
- AMD Zynq™ UltraScale+™ XCZU2EG-1SFVC784E
- 4 GByte DDR4 memory
- 128 MByte QSPI boot flash
- Samtec ADM6-60 board-to-board connector
- 5.2 × 7.6 cm module size
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product code | TE0813-02-2BE81-A |
| Module family | TE0813-02 |
| MPSoC | AMD Zynq™ UltraScale+™ XCZU2EG-1SFVC784E |
| DDR4 memory | 4 GByte |
| QSPI boot flash | 128 MByte |
| Module size | 5.2 × 7.6 cm |
| Board-to-board connector | Samtec ADM6-60 |
| Operating temperature | 0°C to 85°C |
3) Tech Support/Documents
Web available technical information usually covers module documentation, hardware design resources, and development-board materials. There are the following resources for product integration and evaluation. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
- Heat Spreader for Trenz Electronic MPSoC-Module TE0813-02
- UltraITX+ Baseboard for Trenz Electronic TE081X UltraSOM+
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x product