Description and Technical Data:
1) Overview/Key Features
The TE0817-02-7DE81-AS is a complete Starter Kit built around the TE0817-02-7DE81-A MPSoC module and a TEBF0818-02 base board. The module uses an AMD Zynq™ UltraScale+™ ZU7EV device with integrated graphics-processing and video-codec capabilities, 4 GB DDR4 memory, high-speed serial transceivers, configurable I/O, and on-board power-management circuitry.
The Starter Kit is installed in a compact Mini-ITX enclosure and is intended for evaluation, prototyping, embedded Linux development, video processing, image processing, industrial control, communications, and FPGA-based acceleration.
Key features include:
- AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E MPSoC
- Integrated GPU and video codec unit
- Extended temperature-grade MPSoC
- 4 GB DDR4 SDRAM
- 2 × 64 MB QSPI boot Flash
- 2 Kbit MAC-address serial EEPROM with EUI-48 node identity
- 4 × GTR high-speed transceivers
- 16 × GTH high-speed transceivers
- Up to 204 programmable-logic I/Os
- Up to 156 HP I/Os
- Up to 48 HD I/Os
- Up to 65 PS MIOs
- I²C and JTAG interfaces
- 4 × ADM6 board-to-board connectors
- On-board oscillator
- Power supplied to the module through the board-to-board connector
- TEBF0818-02 base board
- Pre-assembled heatsink
- 2 × mounted XMOD FTDI JTAG adapters
- 32 GB Class 10 UHS-I microSDHC card with adapter
- Mini-ITX enclosure
- External SFX power supply
- USB and mains power cables
The TE0817 module has a 5.2 × 7.6 cm form factor. The Starter Kit enclosure provides a practical development platform with front-access USB 3.0 ports, rear cooling, and support for Mini-ITX or Micro-ATX system integration.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product type | MPSoC Starter Kit |
| MPSoC module | TE0817-02-7DE81-A |
| MPSoC device | AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E |
| MPSoC family | Zynq |
| MPSoC architecture | UltraScale+ |
| MPSoC type | MPSoC |
| Speed grade | -1 |
| Temperature grade | Extended |
| MPSoC package | FBVB900E |
| Processing features | Integrated GPU and video codec unit |
| DDR memory | 4 GB DDR4 SDRAM |
| QSPI boot Flash | 2 × 64 MB |
| Total QSPI boot Flash | 128 MB |
| Identification memory | 2 Kbit MAC-address serial EEPROM with EUI-48 node identity |
| PL GTR transceivers | 4 |
| PL GTH transceivers | 16 |
| Programmable-logic I/O | Up to 204 |
| PL HP I/O | Up to 156 |
| PL HD I/O | Up to 48 |
| PS MIO | Up to 65 |
| Interfaces | I²C and JTAG |
| Module connectors | 4 × ADM6 board-to-board connectors |
| Module dimensions | 5.2 × 7.6 cm |
| Module power | Supplied through the board-to-board connector |
| Base board | TEBF0818-02 |
| Cooling | Pre-assembled heatsink |
| JTAG adapters | 2 × mounted XMOD FTDI JTAG adapters |
| Storage card | 32 GB Class 10 UHS-I microSDHC with adapter |
| Enclosure form factor | Mini-ITX |
| Enclosure dimensions | 260 × 190 × 280 mm, W × H × D |
| Enclosure material | 0.5 mm steel and plastic |
| Enclosure weight | Approximately 2 kg |
| Enclosure cooling | 1 × 120 mm rear fan |
| Enclosure front I/O | 2 × USB 3.0 ports |
| Power supply | 300 W SFX power supply, 80+ Bronze |
| Supported motherboard format | Mini-ITX and Micro-ATX |
| Supported graphics-card length | Up to 280 mm |
The Starter Kit is a complete evaluation platform, while the module itself is designed for integration into a customer carrier-board or embedded-system design.
3) Tech Support/Dokuments
Web available technical information usually covers the TE0817 MPSoC module, TEBF0818 carrier board, Starter Kit hardware, electrical and mechanical characteristics, DDR4 memory, QSPI boot memory, high-speed transceivers, programmable-logic I/O, JTAG access, Linux resources, and reference designs.
There are the following technical resources:
- TE0817 Starter Kit product documentation
- TE0817 Starter Kit Wiki documentation
- TEBF0818 carrier-board documentation
- TE0817 StarterKit Linux Design
- TE0817 StarterKit Reference Design
- Hardware design-support files
- Schematics and assembly documentation
- Mechanical and dimensional information
- Vivado reference-design files
- Linux and peripheral example designs
- Boot and configuration resources
- DDR4 and transceiver design information
- Product-change notifications
- Support forum resources
Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
The TE0817 module family and its TEBF0818 carrier-board platform are suitable for customers who need to move from Starter Kit evaluation to a customized embedded design.
The TE0817 StarterKit Linux Design and TE0817 StarterKit Reference Design are also relevant development resources for applications using the ZU7EV MPSoC, video processing, programmable logic, high-speed interfaces, and embedded Linux.
5) Downloads/Links
- Trenz Electronic TE0817 Starter Kit Wiki
- TE0817 StarterKit Reference Design Documentation
- TE0817 StarterKit Linux Design
- TEBF0818 Resources
- Support Forum
6) What is in the package
The package contains.
- 1 x black Kolink Satellite Mini-ITX/Micro-ATX enclosure
- 1 x 300 W be quiet! SFX Power 3 80+ Bronze power supply
- 1 x TE0817-02-7DE81-A MPSoC module with AMD Zynq™ UltraScale+™ ZU7EV
- 1 x TEBF0818-02A base board
- 1 x SuperGrip ATS-X50310P-C1-R0 heatsink, 31 × 31 × 17.5 mm
- 1 x TE0790-03 XMOD FTDI JTAG adapter
- 1 x TE0790-03L XMOD FTDI JTAG adapter
- 1 x 32 GB Class 10 UHS-I microSDHC card with adapter
- 1 x USB Type-A to Mini-B cable
- 1 x black Schuko power cable