Description and Technical Data:
1) Overview/Key Features
The TE0820-05-3BE81ML is a low-profile 4 × 5 cm MPSoC module featuring an AMD Zynq™ UltraScale+™ ZU3EG-1E. It combines processing and programmable logic with 2 GByte of DDR4 SDRAM and 128 MByte of Flash memory for configuration and operation. Its 2.5 mm board-to-board connectors provide a lower-profile alternative to the standard-height TE0820 variant.
Key features include:
- AMD Zynq™ UltraScale+™ XCZU3EG-1SFVC784E
- Quad-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processor
- Mali-400 MP2 graphics processor
- 2 GByte DDR4 SDRAM with a 32-bit data bus
- 128 MByte Flash memory
- 4 PS GTR transceivers and 4 high-speed serial I/O interfaces
- 34 high-performance and 96 high-density programmable logic I/O; 14 PS MIO
- 2 × 100-pin and 1 × 60-pin low-profile, 2.5 mm board-to-board connectors
- Component temperature range of 0°C to +85°C; module operating temperature depends on system design and cooling
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product | TE0820-05-3BE81ML MPSoC module, low profile |
| SoC | AMD Zynq™ UltraScale+™ XCZU3EG-1SFVC784E |
| Speed grade | -1E |
| Application processor | Quad-core ARM Cortex-A53 MPCore |
| Real-time processor | Dual-core ARM Cortex-R5 MPCore |
| Graphics processor | Mali-400 MP2 |
| DDR memory | 2 GByte DDR4 SDRAM, 32-bit data bus |
| Configuration/operation Flash | 128 MByte |
| PS GTR transceivers | 4 |
| High-speed serial I/O | 4 interfaces; support includes PCIe 2.1, SATA 3.1, DisplayPort, USB 3.0, and serial GMII |
| Programmable logic I/O | 34 high-performance and 96 high-density I/O |
| PS MIO | 14 |
| Connectors | 2 × 100-pin and 1 × 60-pin Samtec Razor Beam, 2.5 mm low-profile |
| Dimensions | 50 × 40 mm |
| Component temperature range | 0°C to +85°C; module operating range depends on customer design and cooling |
3) Tech Support/Documents
Web available technical information usually covers module features, technical specifications, connector details, operating conditions, and system integration. There are the following resources: a technical reference manual, design-support files, reference designs with source files, and documentation for compatible baseboards. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
The TEF1002 carrier is referenced in design resources for the TE0820 family. A heat spreader listed for the TE0820 module family may also be relevant; confirm compatibility with the low-profile connectors and the intended thermal setup.
5) Downloads/Links
- Trenz Electronic TE0820 Wiki
- TE0820 Technical Reference Manual
- TE0820 Test Board Reference Design Documentation
6) What is in the package
The package contains.
- 1 x TE0820-05-3BE81ML MPSoC module with AMD Zynq™ UltraScale+™ ZU3EG and low-profile 2.5 mm connectors