Description and Technical Data:
1) Overview/Key Features
The TE0820-05-3BI81ML is a low-profile 4 × 5 cm MPSoC module featuring an AMD Zynq™ UltraScale+™ ZU3EG-1I. It integrates 2 GByte DDR4 memory, 128 MByte SPI boot flash and 8 GByte eMMC, with onboard power supplies and system-control circuitry. Its high-speed board-to-board connectors expose configurable processing-system and programmable-logic I/O for custom carrier-board designs.
Key features include:
- Industrial-temperature-grade SoC variant
- Low-profile design, with a 2.5 mm profile designation
- Gigabit Ethernet PHY and USB 2.0 ULPI transceiver with OTG support
- 132 HP PL I/Os, 14 PS MIOs and 4 PS GTR transceivers
- 3 high-speed board-to-board connectors
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product number | TE0820-05-3BI81ML |
| Module type | MPSoC module |
| SoC | AMD Zynq™ UltraScale+™ XCZU3EG-1SFVC784I |
| DDR4 SDRAM | 2 GByte |
| SPI boot flash | 128 MByte |
| eMMC | 8 GByte |
| Programmable logic I/O | 132 HP PL I/Os |
| Processing-system I/O | 14 PS MIOs |
| High-speed transceivers | 4 PS GTR transceivers |
| Ethernet | Gigabit Ethernet PHY |
| USB | USB 2.0 ULPI transceiver, OTG support |
| System controller | Lattice MachXO2 CPLD |
| Board-to-board connectors | 2 × 100-pin and 1 × 60-pin high-speed connectors |
| Module dimensions | 50 × 40 mm |
| Profile designation | Low profile (2.5 mm) |
| Component temperature grade | Industrial components specified for −40°C to +85°C |
3) Tech Support/Documents
Web available technical information usually covers the technical reference manual, module architecture, connector pinout, electrical characteristics, design resources, and integration considerations. There are the following development resources: technical documentation, reference designs, and hardware design files. Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
A compatible cooling solution is listed for TE0820-series modules. Confirm thermal requirements and mechanical clearances for the final design.
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x product