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Trenz Electronics

MPSoC-Modul mit AMD Zynq™ UltraScale+™ 3CG-L1I, 4 GByte LPDDR4, 4 x 5 cm, LP (TE0823-02-3PIT1ML)

619.00 € 619.00 €

Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The TE0823-02-3PIT1ML is a low-profile 4 × 5 cm MPSoC module featuring the AMD Zynq™ UltraScale+™ XCZU3CG-L1SFVC784I. It integrates 4 GByte LPDDR4 SDRAM, 128 MByte SPI boot flash, 8 GByte eMMC, and a Lattice MachXO2 system controller. Onboard interfaces include Gigabit Ethernet and USB 2.0 ULPI with OTG support. Three low-profile high-speed board-to-board connectors provide configurable I/O. 

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
ModuleTE0823-02-3PIT1ML
SoCAMD Zynq™ UltraScale+™ XCZU3CG-L1SFVC784I
Device family / engineZU3 / CG
Speed grade-1L, low-power variant
Temperature gradeIndustrial; module operating temperature depends on system design and cooling
LPDDR4 SDRAM4 GByte
SPI boot flash128 MByte
eMMC8 GByte
HyperRAM / HyperFLASHNot included
System controllerLattice MachXO2
Ethernet1 × Gigabit Ethernet PHY
USB1 × USB 2.0 ULPI PHY, OTG capable
Programmable logic I/O132 HP PL I/O
Processing system I/O14 PS MIO
High-speed transceivers4 × GTR
Board-to-board connectors3 × Samtec LSHM low-profile sockets
Form factor4 × 5 cm

3) Tech Support/Documents

Web available technical information usually covers module specifications, technical reference documentation, design resources, reference designs, and integration guidance for module and carrier-board connections. There are the following resources: module reference documentation, firmware information, design and advisory notes, reference designs, and handling guidance. Contact Mirifica Industrial for further detailed information for your project.

4) Related Product Suggestion

The product information lists TE0821-01-3BI21MA, TE0965, and TE0825-01-3BQ55-A as related products. Compatible 4 × 5 cm carrier boards are also relevant for system integration.

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 x TE0823-02-3PIT1ML MPSoC module
  • 8 x screws
  • 4 x bolts