Description and Technical Data:
1) Overview/Key Features
The Trenz Electronic TE0835-03-MXE81-A is a compact RFSoC module based on the AMD Zynq™ UltraScale+™ RFSoC XCZU25DR-1FFVE1156E Gen1. It combines programmable logic, Arm processing, integrated RF data converters, DDR4 memory, boot flash, high-speed transceivers, Ethernet, USB, clock-generation circuitry, and a system-controller CPLD in a 6.5 × 9 cm module.
The module is intended for software-defined radio, multiband and multimode communications, RF signal processing, cable infrastructure, DOCSIS equipment, instrumentation, test and measurement, and other applications requiring direct high-speed RF data conversion with programmable digital processing.
Key features include:
- AMD Zynq™ UltraScale+™ RFSoC XCZU25DR-1FFVE1156E Gen1
- Quad-core Arm Cortex-A53 MPCore processor up to 1.3 GHz
- Dual-core Arm Cortex-R5 real-time processor
- 8 × 14-bit RF-ADCs with sampling rates up to 4.096 GSPS
- 8 × 14-bit RF-DACs with sampling rates up to 6.554 GSPS
- 4 GByte DDR4 SDRAM
- 128 MByte SPI boot flash
- 2 Kbit I²C EEPROM with EUI-48™ node identity
- System-controller CPLD
- Programmable high-performance DSPLL
- USB 2.0 OTG transceiver
- Gigabit Ethernet transceiver
- 3 oscillators
- 4 user LEDs
- 2 × Samtec Razor Beam ST5 board-to-board connectors
- 8 GTY transceivers
- 4 GTR transceivers
- 40 total I/Os
- 20 LVDS interfaces
- 32 MIO interfaces
- 6.5 × 9 cm form factor
The integrated RF data converters allow analog-to-digital and digital-to-analog conversion to be combined with FPGA-based digital downconversion, digital upconversion, filtering, modulation, demodulation, and other signal-processing functions. The actual module operating temperature depends on the customer design, carrier board, workload, and cooling solution.
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| Product | TE0835-03-MXE81-A RFSoC module |
| RFSoC device | AMD Zynq™ UltraScale+™ RFSoC XCZU25DR-1FFVE1156E Gen1 |
| Architecture | UltraScale+ |
| Device family | Zynq |
| Device type | RFSoC |
| Device speed grade | -1 |
| Device package | FFVE1156E |
| Application processor | Quad-core Arm Cortex-A53 MPCore, up to 1.3 GHz |
| Real-time processor | Dual-core Arm Cortex-R5 |
| RF analog-to-digital converters | 8 × 14-bit RF-ADCs, up to 4.096 GSPS |
| RF digital-to-analog converters | 8 × 14-bit RF-DACs, up to 6.554 GSPS |
| DDR4 memory | 4 GByte DDR4 SDRAM |
| SPI boot flash | 128 MByte |
| I²C EEPROM | 2 Kbit serial EEPROM with EUI-48™ node identity |
| System controller | System-controller CPLD |
| Clocking | Programmable high-performance DSPLL and 3 oscillators |
| Ethernet | Gigabit Ethernet transceiver |
| USB | USB 2.0 OTG transceiver |
| User indicators | 4 × user LEDs |
| Board-to-board connectors | 2 × Samtec Razor Beam ST5, 2 × 80-pin |
| Total I/O | 40 |
| LVDS interfaces | 20 |
| MIO interfaces | 32 |
| GTY transceivers | 8 |
| GTR transceivers | 4 |
| Input supply voltage | 5 V ±10% |
| Module dimensions | 6.5 × 9 cm |
| Component temperature range | 0°C to +85°C, extended range |
| Module operating temperature | Dependent on customer design and cooling solution |
| Manufacturing | Developed and manufactured in Germany |
The TE0835-03-MXE81-A is the ZU25DR Gen1 variant of the TE0835 RFSoC module family. RF-converter performance, clocking, thermal behavior, and achievable system-level operating conditions depend on the implemented RF design and carrier-board configuration.
3) Tech Support/Dokuments
Web available technical information usually covers the TE0835 Technical Reference Manual, RFSoC resources, RF-ADC and RF-DAC interfaces, memory configuration, boot options, clocking, power requirements, pin assignments, board-to-board connectors, CPLD functions, carrier-board compatibility, reference designs, and hardware-revision information.
There are the following technical-support resources:
- TE0835 technical reference documentation
- RFSoC hardware-interface documentation
- RF-ADC and RF-DAC configuration information
- Reference designs and source projects
- CPLD firmware information
- Pinout and connector documentation
- Power and clocking information
- PCB, mechanical, and STEP-model files
- Trace-length and signal-integrity information
- Product-change notifications
- AMD Zynq™ UltraScale+™ RFSoC documentation
- Vivado Enterprise Edition design-tool information
- Technical-support forum
The TE0835-03 product documentation should be used for revision-specific power-supply, DDR4 timing, clocking, and hardware information when designing a custom carrier board or adapting a reference design.
Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
- TEB0835-03-A PCIe baseboard for TE0835-03 RFSoC modules
- KK0835-03 heat spreader with fan for TE0835-03 RFSoC modules
- Compatible TE0835-03 carrier boards
- AMD RFSoC development tools and Vivado design software
5) Downloads/Links
- TE0835 AMD Zynq UltraScale+ RFSoC
- TE0835 Public Documentation
- PCN-20250401 TE0835-02 to TE0835-03 Hardware Revision Change
- AMD Zynq™ UltraScale+™ RFSoC Product Page
- Vivado Enterprise Edition
- Support Forum
6) What is in the package
The package contains.
- 1 x TE0835-03-MXE81-A RFSoC module with AMD Zynq™ UltraScale+™ RFSoC ZU25DR