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Trenz Electronics

RFSoC Module with AMD Zynq™ UltraScale+™ ZU47DR-1E, 4 GByte DDR4, 6.5 x 9 cm (TE0835-03-TXE81-A)

TE0835-03-TXE81-A is a compact RFSoC module based on the AMD Zynq™ UltraScale+™ RFSoC XCZU47DR-1FFVE1156E Gen3.

8,339.00 € 8,339.00 €

Origin of Goods: Germany
Located and dispatched from: Riedlingen, BW, Germany


Description and Technical Data:

1) Overview/Key Features

The Trenz Electronic TE0835-03-TXE81-A is a compact RFSoC module based on the AMD Zynq™ UltraScale+™ RFSoC XCZU47DR-1FFVE1156E Gen3. It combines programmable logic, Arm processing, high-speed RF data converters, DDR4 memory, boot flash, clock-generation circuitry, high-speed transceivers, Ethernet, USB, and a system-controller CPLD in a 6.5 × 9 cm module.

The module is designed for advanced communications, software-defined radio, multiband and multimode radio systems, cable infrastructure, DOCSIS equipment, high-speed digital signal processing, instrumentation, and custom RF platforms.

Key features include:

  • AMD Zynq™ UltraScale+™ RFSoC XCZU47DR-1FFVE1156E Gen3
  • Quad-core Arm Cortex-A53 MPCore processor up to 1.3 GHz
  • Dual-core Arm Cortex-R5 real-time processor
  • 8 × 14-bit RF-ADCs with sampling rates up to 5 GSPS
  • 8 × 14-bit RF-DACs with sampling rates up to 9.85 GSPS
  • 4 GByte DDR4 SDRAM
  • 128 MByte SPI boot flash
  • 2 Kbit I²C EEPROM with EUI-48™ node identity
  • Lattice MachXO2 system-controller CPLD
  • Programmable high-performance DSPLL
  • USB 2.0 OTG transceiver
  • Gigabit Ethernet transceiver
  • 3 oscillators
  • 4 user LEDs
  • 2 × Samtec Razor Beam ST5 board-to-board connectors
  • 8 GTY transceivers
  • 4 GTR transceivers
  • 40 total I/Os
  • 20 LVDS interfaces
  • 32 MIO interfaces
  • 6.5 × 9 cm form factor
  • Extended component temperature range of 0°C to +85°C

The TE0835-03-TXE81-A is a module-only version. A suitable carrier board and thermal solution should be selected according to the intended application and system design.

NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.

2) Tech Specs

SpecificationDetail
ProductTrenz Electronic TE0835-03-TXE81-A RFSoC module
RFSoC deviceAMD Zynq™ UltraScale+™ RFSoC XCZU47DR-1FFVE1156E Gen3
FPGA/SoC architectureUltraScale+
FPGA/SoC familyZynq
FPGA/SoC typeRFSoC
Device speed grade-1
Device packageFFVE1156
Application processorQuad-core Arm Cortex-A53 MPCore, up to 1.3 GHz
Real-time processorDual-core Arm Cortex-R5
RF analog-to-digital converters8 × 14-bit RF-ADCs, up to 5 GSPS
RF digital-to-analog converters8 × 14-bit RF-DACs, up to 9.85 GSPS
DDR4 memory4 GByte DDR4 SDRAM
SPI boot flash128 MByte
I²C EEPROM2 Kbit serial EEPROM with EUI-48™ node identity
System controllerLattice MachXO2 CPLD
ClockingProgrammable high-performance DSPLL and 3 oscillators
EthernetGigabit Ethernet transceiver
USBUSB 2.0 OTG transceiver
User indicators4 × user LEDs
Board-to-board connectors2 × Samtec Razor Beam ST5, 2 × 80-pin
Total I/O40
LVDS interfaces20
MIO interfaces32
GTY transceivers8
GTR transceivers4
Module form factor6.5 × 9 cm
Component temperature range0°C to +85°C
Input supplyRefer to the applicable TE0835-03 technical documentation for the current revision power-input requirements
ManufacturingDeveloped and manufactured in Germany

The TE0835-03-TXE81-A belongs to the TE0835-03 hardware revision. Revision-specific power, memory-timing, connector, and configuration details should be checked against the current technical documentation before a custom carrier-board design is finalized.

3) Tech Support/Dokuments

Web available technical information usually covers the TE0835 technical reference material, RFSoC resources, hardware interfaces, memory configuration, power requirements, clocking, pin assignments, board-to-board connectors, CPLD functions, reference designs, hardware-revision information, and development procedures.

There are the following technical-support resources:

  • TE0835 Technical Reference Manual
  • TE0835 hardware and interface documentation
  • Reference designs and source files
  • CPLD firmware and configuration information
  • Schematics and assembly documentation
  • PCB design and STEP-model information
  • Trace-length and signal-integrity information
  • Product-change notifications
  • AMD Zynq™ UltraScale+™ RFSoC documentation
  • Vivado Enterprise Edition design-tool information
  • Technical-support forum

The TE0835-03 hardware revision includes updated power-supply circuitry, memory components, I²C functions, clocking, LED circuitry, and board-level design details compared with earlier revisions. 

Contact Mirifica Industrial for further detailed information for your project.

4) Related Product Suggestion

  • TEB0835-03-A PCIe baseboard for Trenz Electronic TE0835-03 RFSoC modules
  • KK0835-03 heat spreader with fan for TE0835-03 RFSoC modules
  • Compatible TE0835-03 carrier boards
  • Suitable JTAG and development accessories listed for the TE0835 product family

5) Downloads/Links

6) What is in the package

The package contains.

  • 1 x TE0835-03-TXE81-A Trenz Electronic RFSoC module with AMD Zynq™ UltraScale+™ RFSoC ZU47DR