Description and Technical Data:
1) Overview/Key Features
The TE0818-02-BBE81-AK is an UltraSOM+ MPSoC module based on the AMD Zynq™ UltraScale+™ ZU15EG-1E. The module combines a high-performance processing system, programmable logic, DDR4 memory, configuration flash, high-speed transceivers, clock generation, and power management in a compact 5.2 × 7.6 cm form factor. This version includes a pre-installed heat spreader for improved thermal management in embedded and industrial applications.
- AMD Zynq™ UltraScale+™ ZU15EG-1E MPSoC
- 4 GByte DDR4 SDRAM
- 128 MByte SPI boot flash
- 2 Kbit serial EEPROM with EUI-48 node identity
- 20 high-speed serial transceivers
- 204 programmable-logic I/O lines: 156 HP and 48 HD
- 65 PS MIO lines and 4 PS GTR interfaces
- 16 PL GTH transceivers
- 4 × 240-pin board-to-board connectors
- High-speed I/O routing for custom carrier-board designs
- On-board clock generation and transceiver clocking
- Integrated power-management system with separately controlled power domains
- 3.3 V supply through the board-to-board connector
- Pre-installed heat spreader
- Compact 5.2 × 7.6 cm module format
NCNR non cancelable - non returnable product. B2B customers please contact Mirifica Industrial for volume quotes. Mirifica Industrial ships world-wide.
2) Tech Specs
| Specification | Detail |
|---|---|
| MPSoC device | AMD Zynq™ UltraScale+™ ZU15EG-1E |
| Device package | FFVC900 |
| Architecture | Zynq UltraScale+ |
| Device type | MPSoC |
| DDR4 SDRAM | 4 GByte |
| SPI boot flash | 128 MByte, implemented as 2 × 64 MByte devices in dual-parallel configuration |
| Serial EEPROM | 2 Kbit with EUI-48 node identity |
| Board-to-board connectors | 4 × 240-pin high-speed connectors |
| Programmable-logic I/O | 204 total: 156 HP and 48 HD |
| PS MIO | 65 |
| PS GTR | 4 |
| PL GTH | 16 transceivers |
| High-speed serial transceivers | 20 |
| Clocking | On-board oscillator, transceiver clocks, and PLL clock generation |
| Power input | 3.3 V through the board-to-board connector |
| Power domains | Separately controlled LP, FP, and PL power domains |
| Module dimensions | 5.2 × 7.6 cm |
| Thermal solution | Pre-installed heat spreader |
| Component temperature rating | Extended-temperature-rated components from 0 °C to +85 °C; the module operating range depends on the customer design and cooling solution |
3) Tech Support/Documents
Web available technical information usually covers the TE0818 UltraSOM+ MPSoC module, connector assignments, memory interfaces, configuration, clocking, power architecture, thermal integration, and carrier-board development. There are the following technical resources:
- TE0818 module documentation
- Hardware design files and reference-design resources
- Connector and pin-assignment information
- Power, clock, memory, and configuration documentation
- Thermal-management and heat-spreader integration information
- Carrier-board development resources
- Vivado-based development support
- Technical support forum resources
Contact Mirifica Industrial for further detailed information for your project.
4) Related Product Suggestion
- TEBF0818 carrier board/base board for TE0818 module evaluation and development
- TE0818 starter kit for a complete development platform with carrier board and enclosure
5) Downloads/Links
6) What is in the package
The package contains.
- 1 x TE0818-02-BBE81-A UltraSOM+ MPSoC module with AMD Zynq™ UltraScale+™ ZU15EG-1E
- 1 x pre-installed heat spreader